Tuesday, December 4, 2018
Trends in semiconductor packaging are being driven by the need for higher density (higher pin
count), smaller and thinner ICs to support small form factor products. Wafer Level Chip-Scale
Packing (WLCSP) is primed to dominate the internet of things (IoT) industry, provided IoT
manufacturers find reasonable solutions to safely handle and program their devices.
Manufacturers are looking to preprogram small form factor ICs and bake in security at the
same time rather than bolting it on as an afterthought. Advancements in robotics handling,
socketing technologies and embedded security software are paving the way for new offline
automated programming solutions specifically designed for handling and securing small parts.
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